Polished Stainless Steel Process Chamber, Custom Vacuum Chamber for Semiconductor
Polished stainless steel process chamber for vacuum, clean semiconductor and coating processes.
Our polished stainless steel process chamber is custom metal fabrication part built for high-purity, clean and vacuum working environments. We adopt electropolishing & mirror polishing treatment to achieve ultra-smooth inner surface, reducing particle retention and contamination risk.
It supports custom sizes, port layout, sight windows, flange connections and internal fixtures. Welds are fully ground and sealed, with helium leak test available for vacuum tightness.
Matched with KF/CF vacuum flanges, sealing gaskets, sensor ports and cooling jackets, this chamber fits semiconductor deposition, etching, thin film coating and R&D lab process systems. Material options include 304 / 316L stainless steel. All units go through strict dimensional, roughness and cleanliness inspection before delivery.
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Oblique Cut Lamination
Contact UsShearing is a common cutting method for silicon steel sheets. Silicon steel is sheared with a carbide blade, which can cut the required size and shape. Shear method on the thermal impact of silicon steel core is small, the kerf is smoother, but the shear force is more damage, easy to produce deformation and burr. Therefore, the shear method is suitable for cutting smaller lamination, the requirement of surface flatness is not too high occasions.
Our company has introduced advanced oblique cut equipment, which is able to cut large silicon steel core to meet more needs of customers.
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